High precision Ceramic Cutting Machine MLCC/MLCI (Chip Capacitor/Inductor) this device is made for the continuous miniaturization of ceramic components in recent years, with high cost performance.
Tap-400/600 precision grinding and polishing machine series equipment is a two axis high-precision single-sided polishing equipment. The polishing head can rotate and swing to realize high-pressure and high-speed polishing. It can be polished in one piece or in multiple pieces to meet the high-precision polishing requirements of various materials.
This equipment is specially designed for chip component products to provide a cutting process after lamination. The equipment uses two sets of CCDs as a visual alignment and imaging system. The hardware is used to take images and process and judge the edge of the block. As the basis for cutting, the Blocks are divided into 4.