Mainly used for bar thickness measurement of chip components.
Equipment use:
Mainly used for bar thickness measurement of chip components.
1. Up and down head to shoot measurement
2. Compatible with suction cups for adsorbing large warped samples (warping height ≤3mm, suction cups are flat)
3. Detection plate size: 0-200mm (maximum 8in)
4. In addition to thickness measurement, it can be extended to realize different measurement methods such as T TV\WRAP\BOW\SORI
5. The software is optimized, easy to operate, and can produce a navigation cloud map that is convenient for evaluation
6. The air-floating coplanar platform provides motion support, has excellent flatness and long-term maintenance-free standard gauge block automatic calibration function
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